A bare die is an integrated circuit that has been obtained from the wafer and is ready for packaging. Availability of integrated circuits in form of a die offers users a convenient option for small-footprint designs, allowing them to optimize designs of their product for limited space and to utilize innovative, proprietary packaging solutions.
Trays to Remain Prominent Carrier Product through 2025
Some of the key products used for the packaging and storage of bare dice are trays, shipping tubes, and carrier tapes. Trays are the most commonly used product owing to the optimum security and safety offered by them. Moreover, they bear lower margin of breakage and are available at low cost, which will ensure their high demand through 2025. Trays in the form of waffle packs help in bulk shipment and offer high protection to silicon chips. Their lightweight allows ease of handling bare die, which is likely to influence the demand for trays positively in the long run.
Demand for carrier tapes is expected to experience a sharp rise in coming years. Carrier tapes include specially designed corner protect features that reduce the possibility of component rotation in the pocket, thereby enabling high tolerance and better protection. Additionally, low price of the product can stir up demand. A raft of companies is focusing on manufacturing advanced carrier tapes, which is anticipated to boost their adoption in near future. For instance, Advantek offers a SURFTAPE®, a unique type of punched carrier tape suitable for placement and protection of bare dice. Components are placed on a wafer film backing within a specially designed compartment boundary, which eliminates that requirement of custom carrier tape tooling.
Market Insights
According to a report by Grand View Research Inc., the global bare die shipping & handling and processing & storage market is estimated to rise to a valuation of USD 1.42 billion by 2025. Surging demand for integrated circuits (ICs) in communication, medical, and automotive applications can provide an upthrust to the market. High cost of bare dice and its vulnerability to atmospheric conditions is creating a dire need for reliable carrier products. Utilization of PTFE, HDPE, and other materials with high chemical, corrosion, and thermal resistance is increasing the dependence of bare die manufacturers on carrier products, which is estimated to augment the market.
North America will account for a substantial share in the market throughout the forecast period (2017–2025). Presence of the Silicon Valley along with expanding electronics manufacturing capacity can contribute to the growth of the regional market. Some of the key players in the market are Entegris, Inc; 3M Company, Brooks Automation, Inc.; Daitron Incorporated; and Micross Components, Inc.
In-Depth Research Report On Bare Die Shipping & Handling And Processing & Storage Market:
https://www.grandviewresearch.com/industry-analysis/bare-die-shipping-handling-processing-storage-market
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